Work

Reliability Analysis and Implementation of Silver Sintering Connection in SiC High-temperature Package

Year: 2025

Type: conference-paper

Source: IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)

DOI: 10.1109/wipda-asia63772.2025.11183891

Authors: Zizhen Cheng, Wenjie Xu, Fengtao Yang, Zhiqiang Zhao, Dewen Wang, Laili Wang

Institutions: State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, China North Industries Group Corporation (China)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4414898415

FWCI: 2.358

Cites: 6

Cited by: 1

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