Work

Low Parasitic Repackaging and Integration of Multiple GaN HEMT Devices

Year: 2025

Type: conference-paper

Source: IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)

DOI: 10.1109/wipda-asia63772.2025.11184003

Authors: Yue Chen, Mingrui Zou, Dongjun Jiang, Senhao Liang, Jiakun Gong, Zheng Zeng

Institution: Chongqing University

Language: English

Topic: GaN-based semiconductor devices and materials

Subfield: Condensed Matter Physics

Field: Physics and Astronomy

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

Funders: National Natural Science Foundation of China, Natural Science Foundation of Chongqing

OpenAlex ID: W4414898512

FWCI:

Cites:

Cited by:

Related to: