Work

Analysis of Influencing Factors on the Thermal Performance of SiC Multi-Chip Parallel Packaging Structure

Year: 2025

Type: conference-paper

Source: IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)

DOI: 10.1109/wipda-asia63772.2025.11183871

Authors: Lei Wang, Rui Jin, Xuebao Li, Peng Zhang, Chao Li

Institution: North China Electric Power University

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4414898514

FWCI: 2.358

Cites: 20

Cited by: 1

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