Work

Impact of Elevated Humidity Conditions on the Thermal and Mechanical Reliability of Silicon Carbide MOSFETs

Year: 2025

Type: conference-paper

Source: IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)

DOI: 10.1109/wipda-asia63772.2025.11184082

Authors: Jiayu Zhang, Dong Xie, Zhiliang Xu, Zepeng Jiang, Xinglai Ge

Institution: Southwest Jiaotong University

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, Fundamental Research Funds for the Central Universities

OpenAlex ID: W4414898562

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