Work

Optimal Design of High-temperature SiC Power Module Based on Gene Algorithm

Year: 2025

Type: conference-paper

Source: IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)

DOI: 10.1109/wipda-asia63772.2025.11184077

Authors: Zhenchun Xia, Jianing Wang, Shaolin Yu, Weina Mao, Xiahao Wang, Honghong Li, Runze Wang

Institutions: Hefei University of Technology, Institute of Energy, Hefei Comprehensive National Science Center, Anhui University of Science and Technology

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

Funder: Research and Development

OpenAlex ID: W4414898568

FWCI:

Cites: 14

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