Work

A Novel Integrated Power Module Package Method with SiC MOSFETs and Energy Absorber in Solid-state Circuit Breaker Application

Year: 2025

Type: conference-paper

Source: IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)

DOI: 10.1109/wipda-asia63772.2025.11183924

Authors: Dongxin Jin, Jie Gong, Yuchen Wang, Cheng Luo, Xiaojun Dong, Guangyin Lei

Institution: Fudan University

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

OpenAlex ID: W4414898706

FWCI:

Cites: 14

Cited by:

Related to: