Work

Baseplate Temperature Gradient-Based Health Status Monitoring for Power Module Bonding Wires

Year: 2025

Type: conference-paper

Source: IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)

DOI: 10.1109/wipda-asia63772.2025.11184053

Authors: Yongxin Chen, Lei Xu, Kun Tan, Xi Tang, Cungang Hu, Wenping Cao

Institution: Anhui University

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Natural Science Foundation of China

OpenAlex ID: W4414898756

FWCI:

Cites: 15

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