Work

Cu/diamond Composite Electrodes for Low Thermal Resistance Packaging in High-Power IGCTs

Year: 2025

Type: conference-paper

Source: IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)

DOI: 10.1109/wipda-asia63772.2025.11183912

Authors: Tang Xinling, Wei Xiaoguang, Lin Zhongkang, Yang Guang, Yu Kefan, Wang Jingfei

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

Funder: Beijing Nova Program

OpenAlex ID: W4414908853

FWCI: 2.325

Cites: 8

Cited by: 1

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