Work

Thermal Network of Double-sided Cooling Power Module Based on Cauer Model

Year: 2025

Type: conference-paper

Source: IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)

DOI: 10.1109/wipda-asia63772.2025.11183953

Authors: Jie Li, Min Chen, Xinnan Sun, Jun Huang, Yucheng Wu, Yifei Du, Han Zhou, Feng Jiang

Institution: Zhejiang University

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

OpenAlex ID: W4414908854

FWCI:

Cites: 9

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