Work

Study on SiC Power Module Cooling Technologies Suitable for High-Junction-Temperature and High-Power-Density Applications

Year: 2025

Type: conference-paper

Source: IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)

DOI: 10.1109/wipda-asia63772.2025.11184096

Authors: Baihan Liu, Jianwei Lv, Yipeng Liu, Yifan Zhang, Siqi Dai, Zexiang Zheng, Suhang Wei, Cai Chen, Yong Kang

Institution: Huazhong University of Science and Technology

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

Funder: National Natural Science Foundation of China

OpenAlex ID: W4414908873

FWCI:

Cites: 9

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