Work

Advanced Packaging for High-Voltage SiC Module with Excellent Thermal, Mechanical, and Electrical Properties

Year: 2025

Type: conference-paper

Source: IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)

DOI: 10.1109/wipda-asia63772.2025.11184075

Authors: Meiyu Wang, Yiting Han, Peng Gao, Zhuo Pang, Yingkun Yang, Haidong Yan

Institutions: Nankai University, China Academy of Engineering Physics, Zhejiang University

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4414908913

FWCI:

Cites: 10

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