Material removal mechanism based on scratched surface and abrasive chips in ultrasonic-assisted grinding of SiCp/Al composites
Year: 2025
Type: article
Abstract: To thoroughly investigate the influence of ultrasonic vibration on the removal process and the removal mechanism, scratching experiments are conducted, and chip shape characteristics are examined. The application of ultrasonic vibration produces a protective shielding effect on the material’s surface cracks, thereby effectively reducing the risk of surface damage to the work piece. Additionally, the critical cutting depth in dynamic conditions can be increased, leading to enhanced plastic removal and reduced occurrence of surface fracture and fragmentation. The aluminum matrix interacts with the reinforcement particles, leading to their removal through plastic deformation. Moreover, certain portions of the substrate material undergo a phenomenon known as substrate coating. The elimination of SiC particles is achieved through the synergistic interaction between brittleness and plasticity, which arises from the continuous variation in the instantaneous cutting depth a p ( t ) of the abrasive on the tool within a specific amplitude range. This process involves phenomena such as particle displacement, detachment, and extraction.
Authors: Ming Wang, YanPeng Gao, ZhenAo Li, XiaoWei Dong
Institution: Heilongjiang Bayi Agricultural University
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $2,650
Award: G2517218364
OpenAlex ID: W4414936237