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From Solutions to Photovoltaic Devices: Assessing the Impact of Zn Complexation for Bifacial Cu 2 ZnSn(S,Se) 4 Thin Films

Year: 2025
Type: article
Abstract: High Resolution Image Download MS PowerPoint Slide Solution-based deposition of high-quality inorganic compound semiconductors onto a variety of substrates is a key challenge toward integrating photovoltaic technologies into a wide range of infrastructures. Cu 2 ZnSn(S,Se) 4 (CZTSSe) is one of the most promising solar absorbers processable by solution-based methods, however there is a substantial knowledge gap linking the chemistry of cation complexes and chalcogen precursors, e.g. thiourea (TU), to the microstructure and opto-electronic properties of the thin-films. In this study, we focus our attention on the complexation of zinc chloride (ZnCl 2 ) and zinc acetate (ZnAc 2 ) in dimethylformamide (DMF)-based CZTS precursor inks and how this ultimately affects the performance of CZTSSe thin-film devices on F/SnO 2 (FTO) substrates. Acetate coordination not only improves the overall CZTSSe composition and structural uniformity but also lowers the zinc salt decomposition temperature, from 519 to 284 °C, which significantly affects the rate of grain growth during selenization and final microstructure. ZnAc 2 -based CZTSSe films show densely packed grain growth due to the fast rate of selenium incorporation during annealing, while ZnCl 2 -based CZTSSe displays slower rates due to the high decomposition temperature of ZnCl 2 . Upon the incorporation of 25 nm Mo at the CZTSSe/FTO interface, a champion power conversion efficiency of 6.02% was achieved with ZnAc 2 precursor salt, over two times greater than the equivalent device architecture prepared with ZnCl 2, at 2.62%. This investigation illustrates the significant role of the molecular complexes in tuning the grain growth kinetics and final microstructure and therefore improving device performance on semitransparent substrates.
Language: English
Open Access status: hybrid
Estimated APC paid: $4,500
OpenAlex ID: W4414942166
FWCI: 0.453
Cites: 59
Cited by: 2
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