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Transient Emulsion-Assisted Fabrication of Liquid Metal Microsphere Arrays for Mechanically Adaptive Anisotropic Conductive Packaging

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Year: 2025
Type: article
Source: Nano Letters
DOI: 10.1021/acs.nanolett.5c03578
Authors: Rui Pan, Dilong Liu, An Cao, Wei Zhang, Yunle Yao, Yi Gong, Lin Chen, Yue Li, Xingyou Tian
Institutions: University of Science and Technology of China, Chinese Academy of Sciences, Hefei Institutes of Physical Science, Institute of Solid State Physics, Tiangong University
Language: English

Topic: Electronic Packaging and Soldering Technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, China Postdoctoral Science Foundation, Youth Innovation Promotion Association of the Chinese Academy of Sciences, Anhui Provincial Department of Education, Hefei Institutes of Physical Science, Chinese Academy of Sciences, Key Laboratory of Photovoltaic and Energy Conservation Materials
Awards: G1218369972, G2921696824, G3801109708, G3916674795, G6168633616, G6885249351, G7749404165, G793740860
OpenAlex ID: W4414969118
FWCI: 0.451
Cites: 56
Cited by: 2
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