Work

Life Cycle Impact Assessment(LCA) of the Soldering Process for Printed Circuit Boards Using openLCA

Year: 2025

Type: article

Source: The Journal of Innovation Industry Technology

DOI: 10.60032/jiit.2025.3.3.133

Authors: 한국공학대학교, Tae-Yeon Kim, Seong-Uk Shin, Jae-Hyun Kim, Seung-ho Park, Kyung-Sun Yoo, Kyung-Taek Min, Young-Soon Baek

Language: English

Topic: Environmental Impact and Sustainability

Subfield: Environmental Engineering

Field: Environmental Science

Domain: Physical Sciences

SDGs: Responsible consumption and production, Climate action

Open Access status: closed

OpenAlex ID: W4415016824

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