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Uncertainty Quantification for Compressible Micro-Interconnects in Replaceable Integrated Chiplet Assembly Under Hypergravity

Year: 2025

Type: article

Source: Journal of Electronic Packaging

DOI: 10.1115/1.4070099

Authors: Liu Chu, Jiajia Shi, Eduardo Souza de Cursi

Institutions: ShanghaiTech University, Nantong University, Institut National des Sciences Appliquées Rouen Normandie

Language: English

Topic: Probabilistic and Robust Engineering Design

Subfield: Statistics, Probability and Uncertainty

Field: Decision Sciences

Domain: Social Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G1007159784

OpenAlex ID: W4415080800

FWCI:

Cites: 28

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