Work

ThermoDynaSMT: A Physics-Informed Machine Learning Model for Component Displacement in Surface Mount Technology

Year: 2025

Type: article

Source: Journal of Electronic Packaging

DOI: 10.1115/1.4070105

Authors: Abdelrahman Farrag, Jaewoo Kim, Zhenxuan Zhang, Daehan Won, Yu Jin

Institutions: Binghamton University, University at Buffalo, State University of New York

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4415082212

FWCI: 0.231

Cites: 22

Cited by: 1

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