Work

PI-ONet: A Physics-Informed Operator Network for Efficient Thermal Analysis of Multilayer Chiplets

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3621061

Authors: Yanliang Sha, Chengxin Zhang, Quan Chen

Institutions: Southern University of Science and Technology, Peng Cheng Laboratory

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, Science, Technology and Innovation Commission of Shenzhen Municipality

Awards: G6355219361, G7307762617

OpenAlex ID: W4415125386

FWCI: 0.453

Cites: 17

Cited by: 2

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