Work

Electroplated Bonding of Copper Pillar Micro-Bumps Using an Accelerator–Suppressor System

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3620364

Authors: Xiaokang Liu, Baoguo Yang, Yuting Zhong, Yixin Pan, Haoze Yang, Junhui Li

Institutions: Central South University, China Electronics Technology Group Corporation

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Science and Technology Major Project

Award: G3367674884

OpenAlex ID: W4415178926

FWCI:

Cites: 23

Cited by:

Related to: