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Three-Dimensional Flow Analysis and Humidity Level Evaluation for a FOUP During Open Door Operation Conditions

Year: 2025

Type: article

Source: IEEE Transactions on Semiconductor Manufacturing

DOI: 10.1109/tsm.2025.3622489

Authors: Anthony Xavier Andrade, Omid Ali Zargar, Yang-Cheng Shih, Graham Leggett, Shih-Cheng Hu

Institutions: National Taipei University of Technology, National Chin-Yi University of Technology, LI-COR Biosciences (United States)

Language: English

Topic: Heat Transfer and Optimization

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4415250804

FWCI: 0.298

Cites: 24

Cited by: 1

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