Work

Reliability Analysis of a Microinverter Prototype: A Case Study on Sn-Ag-Cu Solder Under Thermal Fatigue for Encapsulated GaN Packages

Year: 2025

Type: article

Source: Journal of Electronic Packaging

DOI: 10.1115/1.4070161

Authors: Ibaad Gandikota, Aniket Bharamgonda, Arafat Hasnain, Alireza Khaligh, Abhijit Dasgupta, Patrick McCluskey

Institution: University of Maryland, College Park

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

Funder: Solar Energy Technologies Program

Award: G8767628775

OpenAlex ID: W4415321647

FWCI:

Cites: 13

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