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The Impact of Variations in Heat Carried by Cutting Slurry on the Warpage of 300 mm Silicon Wafers

Year: 2025

Type: article

Source: Journal of Advanced Manufacturing Systems

DOI: 10.1142/s0219686727500247

Authors: Yanxiang Zhao, Yang Rui, Bo Cheng, Liguang Wang, Zhongbao Wang, Tianpei Liu, Shaolin Yang

Institution: North Minzu University

Language: English

Topic: Advanced machining processes and optimization

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Key Research and Development Program of Ningxia

OpenAlex ID: W4415465103

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