Work

Bio-Adhesive Lignin-Reinforced Epoxy Acrylate (EA)-Based Composite as a DLP 3D Printing Material

Year: 2025

Type: article

Abstract: Digital light processing (DLP) 3D printing is a powerful additive manufacturing technique but is limited by the relatively low mechanical strength of cured neat resin parts. In this study, a renewable bio-adhesive lignin was introduced as a reinforcing filler into a bisphenol A-type epoxy acrylate (EA) photocurable resin to enhance the mechanical performance of DLP-printed components. Lignin was incorporated at low concentrations (0-0.5 wt%), and three dispersion methods-magnetic stirring, planetary mixing, and ultrasonication-were compared to optimize the filler distribution. Cure depth tests and optical microscopy confirmed that ultrasonication (40 kHz, 5 h) achieved the most homogeneous dispersion, yielding a cure depth nearly matching that of the neat resin. DLP printing of tensile specimens demonstrated that as little as 0.025 wt% lignin increased tensile strength by ~39% (from 44.9 MPa to 62.2 MPa) compared to the neat resin, while maintaining similar elongation at break. Surface hardness also improved by over 40% at this optimal lignin content. However, higher lignin loadings (≥0.05 wt%) led to particle agglomeration, resulting in diminished mechanical gains and impaired printability (e.g., distortion and incomplete curing at 1 wt%). Fractographic analysis of broken specimens revealed that well-dispersed lignin particles act to deflect and hinder crack propagation, thereby enhancing fracture resistance. Overall, this work demonstrates a simple and sustainable approach to reinforce DLP 3D-printed polymers using biopolymer lignin, achieving significant improvements in mechanical properties while highlighting the value of bio-derived additives for advanced photopolymer 3D printing applications.

Source: Polymers

DOI: 10.3390/polym17212833

Authors: Jeonghong Ha, Jong Wan Ko

Institution: Korea Institute of Industrial Technology

Language: English

Topic: Additive Manufacturing and 3D Printing Technologies

Subfield: Automotive Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: gold

Estimated APC paid: $3,258