Work

MoN x Nanoscale-Thick Films Using BTBMMo and Ammonia in Plasma-Enhanced ALD for Cu Diffusion Barriers in High-Aspect-Ratio Nanohole 3D Interconnects

Year: 2025

Type: article

Source: ACS Applied Nano Materials

DOI: 10.1021/acsanm.5c03862

Authors: Gayeong Cho, Minso Kim, Kihyon Hong, Nari Jeon

Institution: Chungnam National University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funder: National Research Foundation of Korea

Awards: G1999385416, G2581263415, G4090505982

OpenAlex ID: W4415566587

FWCI: 0.163

Cites: 39

Cited by: 1

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