Work

Atomic layer etching for vertical trench control and electrical optimization in high-density low-k materials

Year: 2025

Type: article

Source: Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

DOI: 10.1116/6.0004834

Authors: Sanghyun Lee, HyunWook Ra, Gyeongyun Kim, Seunghyeok Choi, JiSoo Oh, Seungchul Oh, Migyeong Gwon, GyoSeon Choo, Jisu Jeung, HyunSun Song, Yeonsong Kim, Jeongin Kim, JohnSoo Kim, JongMin Baek, Keun Hee Bai

Institutions: Samsung (South Korea), Samsung Electronics (South Korea)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4415659632

FWCI: 0.326

Cites: 14

Cited by: 2

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