TEOS SiO₂ Film Deposition Optimization for Increasing Capability and Securing TSV Robustness of HBM
Year: 2025
Type: article
Authors: Intae Whoang, Byung-Yoon Lim, Kijun Bang, Sang-Un Lee
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4415681840
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