Industry’s First In-line Chip Warpage Measurement Methods for HBM Manufacturing Using UV-In Delamination and a Flux-based Support Layer
Year: 2025
Type: article
Authors: Sangyeop Lee, Junghwi Kim, Intae Whoang, Hongjae Jeong, Gitae Moon, Sunghyun Yoon, Younghoon Lee, Gwangmin Yoon, Sangyup Lee
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4415681857
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