Work

High serving temperature GaSn-based thermal interface material added with Cu@Ni core-shell particles featuring proper fluidity and thermal performance

Year: 2025

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-05-2025-0027

Authors: Wangyun Li, Zelong Li, Song Wei

Institutions: Southwest Jiaotong University, Guilin University of Electronic Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G1590142593

OpenAlex ID: W4415696525

FWCI:

Cites: 12

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