Work

A review of development and applications of SiC power devices in packaging and interconnect technology

Year: 2025

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-05-2025-0032

Authors: Jibing Chen, Yanfeng Liu, Junsheng Yang, Liang He, Hui Tang, Xin Li

Institutions: Wuhan Polytechnic University, Sichuan University, West China Hospital of Sichuan University, University of Electronic Science and Technology of China, State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

Funder: National Natural Science Foundation of China

Awards: G537400700, G5771939611

OpenAlex ID: W4415696642

FWCI: 2.299

Cites: 117

Cited by: 10

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