Work

Mechanical Layout Optimization for Curvy Conformal Electronics With Multilayered Structures

Year: 2025

Type: article

Abstract: Curvy conformal electronics offer broad application potential by integrating diverse multilayered structural components onto target curvy surfaces. The layout design of multilayered structures is crucial for ensuring mechanical reliability. However, there are relatively few studies that have addressed the mechanical layout design for curvy conformal electronics. Here, a theoretical model of the multilayered structure with extremely different elastic properties is established under bending deformation. Theoretical predictions of strain distribution show good agreement with finite element analysis (FEA) results. Furthermore, a mechanical layout optimization guideline is developed for curvy conformal electronics to minimize the stress in ultra-thin chips. The proposed mechanical layout optimization strategy is implemented on various target curvy surfaces to demonstrate its feasibility. This work provides practical insights into the layout design of curvy conformal electronics for enhanced mechanical reliability.

Source: Journal of Applied Mechanics

DOI: 10.1115/1.4070318

Authors: Wei Jian, Guang Yang, Yingchao Zhang, Yinji Ma, Xue Feng

Institutions: Tsinghua University, Jiangnan University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: green

Funder: National Natural Science Foundation of China

Award: G899990266