Work

Shrinking interconnects beyond copper

Year: 2025

Type: article

Source: Science

DOI: 10.1126/science.adu7099

Authors: Mehrdad T. Kiani, Judy J. Cha

Institutions: Florida State University, Cornell University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4415970784

FWCI: 1.296

Cites: 14

Cited by: 8

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