Work

Indium-based self-confining metal foam thermal interface materials for thermo-mechanical-interface coupling in next-generation large die FCBGA packages

Year: 2025

Type: article

Source: International Journal of Thermal Sciences

DOI: 10.1016/j.ijthermalsci.2025.110432

Authors: Jing Wen, Linzheng Fu, Haikun Zhang, Jinyang Su, Guoliao Sun, Yi Fan, Liancheng Wang, Wenhui Zhu, Zhuo Chen

Institution: Central South University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Central South University, Natural Science Foundation of Hunan Province, Key Research and Development Project of Hainan Province, Changsha Science and Technology Project

Awards: 沉积法构筑集成电路高密度封装中Cu-Cu互连的基础研究, G5218408759, G611946990

OpenAlex ID: W4416018786

FWCI: 0.231

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Cited by: 1

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