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A lightweight Co1Ni0.5@NC/SiCf filler with excellent low-frequency electromagnetic wave absorption and heat dissipation for electronic packaging

Year: 2025

Type: article

Source: Chemical Engineering Journal

DOI: 10.1016/j.cej.2025.170604

Authors: Xingtao Liu, Luyang Li, Qi Cao, Yongjun Huo, Xiulan Wang, Lihong Gao, Zhuang Ma, Gang Zhang, Miao Jiang

Institutions: Beijing Institute of Technology, Southeast University, Aerospace Research Institute of Materials and Processing Technology

Language: English

Topic: Electromagnetic wave absorption materials

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: Beijing Normal University, Beijing Institute of Technology, Basic and Applied Basic Research Foundation of Guangdong Province

Award: G5898714946

OpenAlex ID: W4416019795

FWCI: 1.115

Cites:

Cited by: 7

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