Multidirectional envelope forming of copper component with thin baseboard and high ribs
Year: 2025
Type: article
Authors: Xinghui Han, Xinhong Yuan, Duanyang Tian, Wuhao Zhuang, Fangyan Zheng, Lin Hua
Institution: Wuhan University of Technology
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4416024295
