Work

Insulation Layers on Copper Surfaces of Ceramic Circuit Boards for Smart Power Modules

Year: 2025

Type: conference-paper

DOI: 10.23919/empc63132.2025.11222496

Authors: Claudia Feller, Henry Barth, Stefan Körner, Lars Rebenklau

Institution: Fraunhofer Institute for Ceramic Technologies and Systems

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4416078335

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