Work

Etch Products of Copper Atomic Layer Etching by Oxidation and Formic Acid Vapor

Year: 2025

Type: article

Source: The Journal of Physical Chemistry C

DOI: 10.1021/acs.jpcc.5c05732

Authors: Taylor G. Smith, Jaya M. Nolt, Shao-Liang Zheng, Ethan J. Crumlin, Jerry Hu, Jane P. Chang

Institutions: University of California, Los Angeles, University of California, Santa Barbara, Harvard University, Lawrence Berkeley National Laboratory, Advanced Light Source

Language: English

Topic: Semiconductor materials and devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Science Foundation, U.S. Department of Energy, Basic Energy Sciences

Awards: G30714459, Materials Research Science and Engineering Center at UCSB, Atomic layer etching through controlled surface chemistry, Self-limited etching for atomic scale surface engineering of metals: understanding and design, G8926209874

OpenAlex ID: W4416095013

FWCI: 0.227

Cites: 38

Cited by: 1

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