Work

Chip-Scale 3D Quilt Packaging for Modular Neural Implants

Year: 2025

Type: conference-paper

Source: European Microelectronics and Packaging Conference

DOI: 10.23919/empc63132.2025.11222409

Authors: Chloé Bernardoni, Ahmad Shah Idil, Lewis Keeble, Timothy G. Constandinou

Institution: Imperial College London

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Imperial College London

OpenAlex ID: W4416136151

FWCI:

Cites: 33

Cited by:

Related to: 10