Work

Fan Out Wafer Level Packaging – Towards a European Manufacturing Supply Chain

Year: 2025

Type: conference-paper

DOI: 10.23919/empc63132.2025.11222469

Authors: Marc Dreissigacker, Daniel Lieske, Markus Woehrmann, Tanja Braun, Aleksandr Keller

Institution: Fraunhofer Institute for Reliability and Microintegration

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4416136498

FWCI:

Cites: 4

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