Investigation of RF Characteristics of Inter-Chiplet Connections for Advanced HPC Packaging Solutions
Year: 2025
Type: conference-paper
Authors: Alexander Gäbler, Xunqi Zhang, Uwe Maaß, Marius Adler, Kai Zoschke, Ivan Ndip
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4416136790