Work

Fine-Pitch Die-to-Wafer Bonding Technologies for Chiplet Integration

Year: 2025

Type: conference-paper

DOI: 10.23919/empc63132.2025.11222521

Authors: Juliana Panchenko, Laura Wenzel, Steffen Bickel, Adil Shehzad, Fabian Hopsch, Sebastian Quednau, Manuela Junghaehnel

Institutions: Fraunhofer Institute for Reliability and Microintegration, All Silicon System Integration Dresden, Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS, Fraunhofer Institute for Integrated Circuits

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4416136876

FWCI: 2.325

Cites: 14

Cited by: 1

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