Work

Numerical Case Study of Stress and Plastic Strain Distributions in BGA Solder Balls by Comparison of a Novel Inorganic Encapsulation and Conventional Underfill Variants

Year: 2025

Type: conference-paper

DOI: 10.23919/empc63132.2025.11222459

Authors: Alexander Reichel, Sandy Klengel, Falk Naumann

Institution: Fraunhofer Institute for Microstructure of Materials and Systems

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4416136996

FWCI: 2.358

Cites: 10

Cited by: 1

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