Work

Development of a Novel Pure-Ag-Sintering Paste for a Jet-Dispensing Process to Achieve Highest Possible Conductivity for Miniaturized Electronic Components with a Pressure-Less Sintering Process

Year: 2025

Type: conference-paper

DOI: 10.23919/empc63132.2025.11222476

Authors: Battist Rábay, Julien Hossain, Martin Schneider-Ramelow, Adrian Stelzer, Martin Wozniak, Karl-Friedrich Becker

Institutions: Technische Universität Berlin, Fraunhofer Institute for Reliability and Microintegration

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4416137002

FWCI:

Cites: 3

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