Work

The role of PI thickness and opening dimensions on void suppression in solder bump fabrication

Year: 2025

Type: article

Source: Microelectronics International

DOI: 10.1108/mi-08-2025-0175

Authors: Lei Zhang, Te Li, Zhengkai Zhang, Zhongnan Zhang, Shuai Zhang, Chengqian Wang

Institutions: China Electronics Technology Group Corporation, Harbin Institute of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4416177113

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Cites: 18

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