Work

Crackle‐Templating and Defect‐Healing Electrodeposition for Cu/CuS Mesh Films: Enabling Corrosion‐Resistant High‐Performance Transparent Electronics

Year: 2025

Type: article

Source: Advanced Functional Materials

DOI: 10.1002/adfm.202518786

Authors: Xinkong Wei, Yue Pei, Tianhao He, Wenxi Guo, Weihua Han

Institutions: Lanzhou University, Xiamen University

Language: English

Topic: Nanomaterials and Printing Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Fundamental Research Funds for the Central Universities

Awards: G1111771889, G2282849763, G7814207055

OpenAlex ID: W4416207429

FWCI: 0.231

Cites: 45

Cited by: 1

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