Work

Tailored Interfacial sp 2 /sp 3 Hybridization in Diamond@DLC Heterostructure: Resolving the Microwave Absorption-Dielectric-Thermal Trilemma in Epoxy Composites for Electronic Packaging

Year: 2025

Type: article

Source: ACS Applied Materials & Interfaces

DOI: 10.1021/acsami.5c16308

Authors: Zhicheng Wu, Qingzhe Zhu, Zhijun Ai, Qinhao Bu, Ruitao Ma, Zehao Zhang, Chunyang Xu, Xianhua Huan, Qiaogen Zhang

Institutions: Xi'an Jiaotong University, National University of Defense Technology, Hefei University of Technology

Language: English

Topic: Electromagnetic wave absorption materials

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G5187061723

OpenAlex ID: W4416239110

FWCI: 0.966

Cites: 61

Cited by: 6

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