RF Performance of CMOS Technology Passive Devices Using 3D Hybrid Bonding Interconnections at mm-Wave Frequencies
Year: 2025
Type: conference-paper
Institutions: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, CEA Grenoble, Laboratoire d'Électronique des Technologies de l'Information, STMicroelectronics (France), Institut polytechnique de Grenoble, Centre National de la Recherche Scientifique, Techniques of Informatics and Microelectronics for Integrated Systems Architecture
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4416250347