Year: 2025
Type: article
Abstract: Radio frequency (RF) system in package (SiP) is a packaging technology that integrates multiple chips (including RFICs, digital ICs and passive components) into a single package to form a compact RF system. It enables smaller form factor by placing different functional components into one single package. While most finite element analysis (FEA) of chip package interaction (CPI) study cover details on either die back end of line (BEOL) or under bump metallization (UBM) structure, this paper adopts a different approach. It uses a global model type approach and focuses on relative comparison in RF design CPI study. RF-SiP related features, such as die to die/component interaction, double side related influence; die size and die aspect ratio impact are discussed. The findings hope to shed light on the design of new SiP Packages.
Source: IMAPSource Proceedings
DOI: 10.4071/001c.147193
Authors: Jiaping Zhang, Yonghao An
Institution: Qualcomm (United States)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W4416288164
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