Year: 2025
Type: article
Abstract: Seed copper metallization on glass has been achieved by simple wet chemistry methods that involve deposition an adhesion promoting organic material which enables metallization without any special or high-temperature treatment of the glass substrate. The coating is catalytically activated by depositing atomic palladium using LMIx®, a Liquid Metal Ink organic precursor of palladium with a low contact angle, in which the “x” subscript denotes formulaic tailoring to specific substrate applications. Catalytic atomic palladium was generated on the organic coating by thermal processing at <230°C or in fact at room temperature by using an appropriate reducing agent. The catalytic layer/s of atomic palladium respond faithfully to commercial electroless copper chemistries furnishing a conductive copper layer. The adhesion of the copper layer was tested using conventional cross-hatch testing and nano-scratch testing methods. AFM was used as a tool to monitor changes in surface roughness during multiple process steps. FESEM/EDX spectra were taken after catalytic palladium and SEM of electroless copper deposition. Also, XPS imaging was used to further understanding the chemical conversion of atomic palladium. DSC/TG runs of the atomic palladium ink formulation in air were used to suggest appropriate thermal processing parameters. Sheet resistance of electroless copper was assessed by the 4-point probe method. Glass substrates with high aspect-ratio Through Glass Vias were subjected to BIB/FIB followed by SEM/EDS analysis to determine coverage and conformality of electroless copper deposition in the vias.
Source: IMAPSource Proceedings
DOI: 10.4071/001c.147206
Authors: Shuyang Kao, Ying-Hsuan Yeh, Simon McElrea, Roger Terrill, Sunity Sharma
Institution: San Jose State University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W4416293889
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