Year: 2025
Type: article
Abstract: This paper presents the development of an innovative optical ball grid array (OBGA) packaging structure for automotive applications focused on process development, optimization and achieving the Automotive Electronics Council (AEC) AEC-Q100 Grade 2 reliability requirements. This new concept expands the package portfolio beyond the current cavity packages used for microelectromechanical systems (MEMS) products in production today. The innovative package features a glass lid that replaces the traditional metal or liquid crystal polymer (LCP) lid on MEMS products, eliminating the need for venting holes. This design change helps prevent particle contamination in the sensor area, enhancing the overall reliability and performance of the optical sensors. The optimized cavity package technology is applied to an optical sensor product and its effectiveness was confirmed through a feasibility study and reliability testing.
Source: IMAPSource Proceedings
DOI: 10.4071/001c.147100
Authors: WonBae Bang, Weilung Lu, Adrian Arcedera, KiDong Sim
Institution: Amkor Technology (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W4416293920
FWCI:
Cites:
Cited by:
Related to: