Year: 2025
Type: article
Abstract: Low-temperature processable polyimide was prepared for 3D stacking polymer hybrid bonding technology. The material has confirmed its reliabilities for semiconductor dielectric film and processabilities such as chemical mechanical polishing. Furthermore, gas permeability of the polyimide film was measured by a differential pressure method. Moreover, the amount of water vapor that can be permeated through insulating layer during the annealing process was estimated. Finally, a series of tests confirmed that water vapor released from the bonded chip.
Source: IMAPSource Proceedings
DOI: 10.4071/001c.147185
Authors: Kota Nomura, Masaya Jukei, Yugo Tanigaki, Kai Ishigami, Takenori Fujiwara, Yu Shoji, Hitoshi Araki
Institution: Toray Industries, Inc. (Japan)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W4416293989
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